收藏本站
MCP14E9/10/11
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1 .
TABLE 3-1:
PIN FUNCTION TABLE
PDIP, SOIC,
6x5 DFN
1
2
3
4
5
6
7
8
9
MCP14E9
ENB_A
IN A
GND
IN B
OUT B
V DD
OUT A
ENB_B
EP
Symbol
MCP14E10
ENB_A
IN A
GND
IN B
OUT B
V DD
OUT A
ENB_B
EP
MCP14E11
ENB_A
IN A
GND
IN B
OUT B
V DD
OUT A
ENB_B
EP
Description
Ouptut A Enable
Input A
Ground
Input B
Output B
Supply Input
Output A
Output B Enable
Exposed metal pad ( DFN package only ). Exposed pad is
electrically isolated.
3.1
Enable A (ENB_A)
3.5
Supply Input (V DD )
The ENB_A pin is the enable control for Output A. This
enable pin is internally pulled up to V DD for active-high
operation and can be left floating for standard opera-
tion. When the ENB_A pin is pulled below the enable
pin, Low Level Input Voltage (V EN_L ), Output A will be
in the OFF state, regardless of the input pin state.
V DD is the bias supply input for the MOSFET driver and
has a voltage range of 4.5V to 18V. This input must be
decoupled to ground with a local ceramic capacitor.
This bypass capacitor provides a localized low-
impedance path for the peak currents that are provided
to the load.
3.2
Control Inputs A and B (IN A; IN B)
3.6
Enable B (ENB_B)
The MOSFET driver inputs are a high-impedance
TTL/CMOS compatible input. The inputs also have
hysteresis between the high and low input levels,
allowing them to be driven from slow rising and falling
signals, and to provide noise immunity.
3.3 Ground (GND)
Ground is the device return pin. The ground pin should
have a low-impedance connection to the bias supply
source return. High peak currents will flow out the
ground pin when the capacitive load is being
discharged.
The ENB_B pin is the enable control for Output B. This
enable pin is internally pulled up to V DD for active-high
operation, and can be left floating for standard opera-
tion. When the ENB_B pin is pulled below the enable
pin, Low-Level Input Voltage (V EN_L ), Output B will be
in the OFF state, regardless of the input pin state.
3.7 Exposed Metal Pad (EP)
The exposed metal pad of the DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane, or other cop-
per plane on a printed circuit board, to aid in heat
removal from the package.
3.4
Outputs A and B (OUT A; OUT B)
Outputs, A and B, are CMOS push-pull outputs that are
capable of sourcing and sinking 3.0A of peak current
(V DD = 18V). The low output impedance ensures the
gate of the MOSFET will stay in the intended state,
even during large transients.
? 2011 Microchip Technology Inc.
DS25005A-page 11
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
MCP1640RD-4ABC BOARD REF DES AAAA BAT BOOST
MCP3906AT-E/SS IC ENERGY METERING 24SSOP
MCP3907T-I/SS IC ENERGY METER W/OSC 24SSOP
MCZ33198EF IC TMOS DRIVER AUTO HISIDE 8SOIC
MCZ33285EFR2 IC TMOS DRIVER DUAL HISIDE 8SOIC
MCZ33927EK IC FET PRE-DRIVER 3PH 54-SOIC
MCZ33937EKR2 IC PRE-DRIVER 3PHASE 54-SOIC
MDN2BL3GRAS MOTOR BRUSHED DC 2V 2753RPM
相关代理商/技术参数
MCP14E9T-E/SN 功能描述:功率驱动器IC 2A MOSFET Driver RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube
MCP-14-I9-LL 制造商:YAMAICHI 制造商全称:Yamaichi Electronics Co., Ltd. 功能描述:MatchCon
MCP-14-TI9-LL 制造商:YAMAICHI 制造商全称:Yamaichi Electronics Co., Ltd. 功能描述:MatchCon
MCP1525 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:2.5V and 4.096V Voltage References
MCP1525_05 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:2.5V and 4.096V Voltage References
MCP1525_13 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:2.5V and 4.096V Voltage References
MCP1525I/TO 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:2.5V and 4.096V Voltage References
MCP1525-I/TO 功能描述:基准电压& 基准电流 2.5V RoHS:否 制造商:STMicroelectronics 产品:Voltage References 拓扑结构:Shunt References 参考类型:Programmable 输出电压:1.24 V to 18 V 初始准确度:0.25 % 平均温度系数（典型值）:100 PPM / C 串联 VREF - 输入电压（最大值）: 串联 VREF - 输入电压（最小值）: 分流电流（最大值）:60 mA 最大工作温度:+ 125 C 封装 / 箱体:SOT-23-3L 封装:Reel